1. Juanjuan Hao, Yishu Wang, Yufeng Wu, andFu Guo, Metal recovery from waste printed circuit boards: A review for current status and perspectives. Resources, Conservation and Recycling, 2020, 157: 104787.

2. Yu Tian, Limin Ma, Yishu Wang,Fu Guo, Zhijie Sun, The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields, Journal of Electronic Materials, 2019, pp1-10;

3. Jing Han,Fu Guo, Double tricrystal nucleation behavior in Pb-free BGA solder joints, Microelectronics Reliability, 2019, vol 98, pp1-9;

4. Yutian Shu, Ran Zhao,Fu Guo, Improvement of thermoelectric properties via combination of nanostructurization and elemental doping. JOM, 2014, 66(11): 2298-2308.

5.Fu Guo, M. Zhao, Z. Xia, Y. Lei, X. Li, and Y. Shi, Lead-free solders with rare earth additions , JOM 61(6), 39(2009)

6.Fu Guo, Guangchen Xu, and Hongwen He, “Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints”, Journal of Materials Science, 44(20), 5595(2009).

7.Fu Guo, Guangchen Xu, Jia Sun, Zhidong Xia, Yongping Lei, Yaowu Shi, and Xiaoyan Li, “Resistance changes in eutectic SnBi solder joints during electromigration,” Journal of Electronic Materials, 38(12), 2756(2009).

8.Fu Guo, Composite lead-free electronic solders , J Mater Sci: Mater Electron, volume 18, Numbers 1-3, ISSN 0957-4522 March 2007, pp.129

9. K.F. Hsu, S. Loo,F. Guo, W. Chen, J. S. Dyck, C. Uher, T. Hogan, E. K. Polychroniadis, M.G. Kanatzidis, “Cubic AgPbmSbTe2+m: Bulk Thermoelectric Materials with High Figure of Merit”, Science, 303, 818 (2004).

10. J.R. Salvador,F. Guo, T. Hogan, and M.G. Kanatzidis, “Zero Thermal Expansion in YbGaGe due to an Electronic Valence Transition”, Nature, 425, 704 (2003).

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